Product Brochure/Datasheet
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Each of several items in a list, preceded by a bullet symbol for emphasis. For easy access to this data, refer to the "BulletPoints" tag in XML or JSON.
:
- - Upgraded compound for better heat dissipation
- - High CPU/GPU conductivity (9 W/m.k)
- - Improves heat transfer from chipset to cooler base or heat pipes
- - Easy to spread and remove without damaging the surface
Long product name Cooler Master MasterGel Pro V2 heat sink compound Thermal paste 9 W/m·K 4 g
:
9 W/m-k, 2.6 g/cm3, 1.5ml, Gray
The long product name of Cooler Master MasterGel Pro V2 heat sink compound Thermal paste 9 W/m·K 4 g. For easy access to this data, refer to the "ProductDescription" block and the "ShortDesc" tag in XML or the "Description" block and the "LongProductName" tag in JSON.
9 W/m-k, 2.6 g/cm3, 1.5ml, Gray
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Short summary description Cooler Master MasterGel Pro V2 heat sink compound Thermal paste 9 W/m·K 4 g:
This short summary of the Cooler Master MasterGel Pro V2 heat sink compound Thermal paste 9 W/m·K 4 g data-sheet is auto-generated and uses the product title and the first six key specs.
Cooler Master MasterGel Pro V2, Thermal paste, 9 W/m·K, 2,6 g/cm³, Grey, 1,5 ml, 4 g
Long summary description Cooler Master MasterGel Pro V2 heat sink compound Thermal paste 9 W/m·K 4 g:
This is an auto-generated long summary of Cooler Master MasterGel Pro V2 heat sink compound Thermal paste 9 W/m·K 4 g based on the first three specs of the first five spec groups.
Cooler Master MasterGel Pro V2. Type: Thermal paste, Thermal conductivity: 9 W/m·K, Density: 2,6 g/cm³. Volume: 1,5 ml, Weight: 4 g. Quantity per pack: 1 pc(s), Package width: 82 mm, Package depth: 200 mm