Product Brochure/Datasheet
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Each of several items in a list, preceded by a bullet symbol for emphasis.
:
- - Upgraded compound for better heat dissipation
- - High CPU/GPU conductivity (9 W/m.k)
- - Improves heat transfer from chipset to cooler base or heat pipes
- - Easy to spread and remove without damaging the surface
Long product name Cooler Master MasterGel Pro V2 heat sink compound Thermal paste 9 W/m·K 0.141 oz (4 g)
:
9 W/m-k, 2.6 g/cm3, 1.5ml, Gray
The short editorial description of Cooler Master MasterGel Pro V2 heat sink compound Thermal paste 9 W/m·K 0.141 oz (4 g)
9 W/m-k, 2.6 g/cm3, 1.5ml, Gray
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Short summary description Cooler Master MasterGel Pro V2 heat sink compound Thermal paste 9 W/m·K 0.141 oz (4 g):
This short summary of the Cooler Master MasterGel Pro V2 heat sink compound Thermal paste 9 W/m·K 0.141 oz (4 g) data-sheet is auto-generated and uses the product title and the first six key specs.
Cooler Master MasterGel Pro V2, Thermal paste, 9 W/m·K, 2.6 g/cm³, Gray, 1.5 ml, 0.141 oz (4 g)
Long summary description Cooler Master MasterGel Pro V2 heat sink compound Thermal paste 9 W/m·K 0.141 oz (4 g):
This is an auto-generated long summary of Cooler Master MasterGel Pro V2 heat sink compound Thermal paste 9 W/m·K 0.141 oz (4 g) based on the first three specs of the first five spec groups.
Cooler Master MasterGel Pro V2. Type: Thermal paste, Thermal conductivity: 9 W/m·K, Density: 2.6 g/cm³. Volume: 1.5 ml, Weight: 0.141 oz (4 g). Quantity per pack: 1 pc(s), Package width: 3.23" (82 mm), Package depth: 7.87" (200 mm)